Hello everybody, We have a new product having a lot of open gold area. solder splashes during the reflow is a pain in the... Its an extremely small PCB and kapton taping is not an option. Stencil is at 10% reduction, Cleaning after every cycle. Reflow Ramp rate is < 1 deg C/sec. After a lot of struggle the fall out is at 5% (unacceptable of course....). Any suggestions?