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Help for replacing BGA with metal heat sink

Denis C

#25836

Help for replacing BGA with metal heat sink | 25 September, 2003

We bought a Ersa rework station (IR technology) recently and we found in trouble when having to replace BGA with metal heat sink cover. I am affraid that we will probably have to invest money again in a convection rework system. Does someone can refer some documentation or web site on replacing this particular type of BGA ?

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#25837

Help for replacing BGA with metal heat sink | 25 September, 2003

Greetings Denis,

Could you be a little more vague on the type of BGA. Who happens to make this beaty? Is it a TI DSP?

B

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Denis C

#25838

Help for replacing BGA with metal heat sink | 25 September, 2003

To be precise, the component is a Xilinx Virtex platform FPGA with 1152 balls. We also assemble some DSPs up to 1000 balls with metal cover. At best, we can remove the components but it is almost impossible to find a working solder profile using IR. The metal seems to not absorb the IR.

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#25842

Help for replacing BGA with metal heat sink | 25 September, 2003

Denis: You could be correct about metal reflecting IR. When we use our old IR station, we place pieces of aluminum foil around the component to be removed to protect the near-by components.

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Gabriele

#25849

Help for replacing BGA with metal heat sink | 26 September, 2003

Forced gas (hot air or N2 according to solder paste or flux) will be the solution.

To rework Ceramic (Aluminum lid Heat Sink)BGA (32 mm square ) or Ceramic Colum Grid Array C-CGA 1,25 and 1,00 mm colum (pitch 42,5mm square), also them capped with aluminum lids, the forced air was a must, including bottom side of PBA heated by forced hot air. (ie, A-V DRS-24)

Gabriele

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