Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.



EIA vs. CECC | 10 September, 2003

A customer recently questioned our use of the EIA curves for derating SMT devices for increased ambient temperatures. The European method (CECC) is much more severe in derating power ratings of devices as temp increases, but there are differences in design criteria and measurement methods that may narrow the gap. Does anybody understand the differences well enough to explain?

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