Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

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SMT gold plated components

Carol

#25386

SMT gold plated components | 6 August, 2003

This is an old topic, but keeps coming up. Solderability and reliability issues with SMT gold plated terminations when used with tin/lead solder paste/hassle finish PWB.

I need to know which standard (mil, IPC, J-STD??) tells you all about the problems.

Thanks in advance....

Carol

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#25387

SMT gold plated components | 6 August, 2003

Well, if it "keeps coming up", let's take a pass at keeping down. For: * Requirement that gold be removed from components, pads, etc. is J-STD-001C, 5.4.1 * Context of that requirement [J-STD-001C, 5.4.1] and 6 or 7 references are in IPC-HDBK-001.

Additionally, search the fine SMTnet Archives for discussion about: * Limits of the amount of gold that may be contained in a solder connection and still retain reasonable reliability. * Intermetallic compounds that gold forms with tin.

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Carol

#25390

SMT gold plated components | 7 August, 2003

Thanks Dave, Much appreciated.

Carol

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