Dye Penetrant Inspection of solder joint| 27 June, 2003
HI, I'm doing a dye penetrant and peel test of non-function BGA solder joints to locate the fracture surface. After applying dye, I found the dye ink just accumulate at the solder mask edge and spread everywhere after I peeled off the package. THis is happened even after I bake the samples at 125C for three days. I can't find the way to dry the ink before I peel the package off so there is no meaningful results can be obtained. Anyone know the way to dry the ink within one or two days? All input are welcomed. Thx!