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Dye Penetrant Inspection of solder joint

Ben

#25006

Dye Penetrant Inspection of solder joint | 27 June, 2003

HI, I'm doing a dye penetrant and peel test of non-function BGA solder joints to locate the fracture surface. After applying dye, I found the dye ink just accumulate at the solder mask edge and spread everywhere after I peeled off the package. THis is happened even after I bake the samples at 125C for three days. I can't find the way to dry the ink before I peel the package off so there is no meaningful results can be obtained. Anyone know the way to dry the ink within one or two days? All input are welcomed. Thx!

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#25007

Dye Penetrant Inspection of solder joint | 28 June, 2003

We form a barrier to contain the dye, but regardless it is messy. Actually, we no longer use dye, per say. We use the stuff machinists use for staining metal. Look here for hints: * http://www.ivf.se/Elektronik/dye_penetrant/edefault.htm * http://www.amkor.com/products/notes_papers/SMTAI_2000_Darveaux.pdf * Dye-and-pry failure analysis (technique described in B. Mullen, A. Hertz, B. Miles, and R. Darveaux [�Plastic Ball Grid Array Assembly,� Ball Grid Array Technology, J. Lau Editor, McGraw-Hill, Inc., New York, 1995]) * Process Sciences Inc [3585 County Road 272 Ste 400 Leander, TX 78641 512-259-7070 http://www.process-sciences.com ], I recall, wrote a newsletter, fairly recently, with a section on dye & pry.

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