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Flip Chip Underfil process

#24975

Flip Chip Underfil process | 26 June, 2003

Hello,

What are the ways of placing underfill material under the flip chip.I read about dispensing from one side and dispensing from 2 sides. There must be other ways and I suppose some of you know them.I will appreciate any knowledge on the subject. Thank you!

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CAL

#24976

Flip Chip Underfil process | 26 June, 2003

Depends on your Material (Chemistry) and Machine. We use a hot plate with the material in an "L" patern. The Hot plate is used only in aiding the capillary action. Also, is time an issue??

Here is a good paper from Asymtek that was poster in Advance Packaging: http://www.asymtek.com/news/articles/2003_06_underfill_techniques_adv_pkg_alan_lewis.pdf

this gives some good tips on underfill

Cal Driscoll Communications Test Design, Inc. www.ctdi.com

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