Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


High frequency application board V.S rework CSP

Por

#24641

High frequency application board V.S rework CSP | 30 May, 2003

Hi all

I am facing the problem with reoworking CSP component for high frequency application boards. Our customer do not allow us to use tacky fluxes due to high frequency application and component has low standoff ,and the ball pad and ball size is too less to print solder paste. Anyone has any solution or guideline to rework this type of component or know the type of tacky fluxe that used for High frequency application pls. help advise. Thanks very much. Ben

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CAL

#24646

High frequency application board V.S rework CSP | 30 May, 2003

Ben- My understanding of Tacky Flux is for Automation process where the Tacky Flux helps hold the component in place. If you are using a rework system that holds the Board firm..then typical no clean flux (Flux Pen) should work fine. I can only asume the type of rework station you have. Typically the reason they do not want you to use Tacky Flux is because the inpedence levels will change and the board could be thrown way out of tune.

Cal Communications Test Design, Inc www.ctdi.com

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