Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Failure analysis

Henry Lee

#24562

Failure analysis | 22 May, 2003

Hi I uploaded the photos http://hk.photos.yahoo.com/ee02lyk of the failure samples. The chip-cut and pin-hole were found after the manufacturing process. I initially suspect the crack happened during the reflow process.However, our factory analysis does not seems to agree. I need to know the possible root cause of failure.

So, I really hope that you can share your experience

Thanks in advance for any assistance

Henry Lee Hong Kong SAR

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Kris

#24567

Failure analysis | 22 May, 2003

What solder are you using ? what is the peak temeprature ?

Are you using the right tools to place these components ?

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#24568

Failure analysis | 22 May, 2003

Henry are you thinking ball peen hammer?

Initial questions are: * If there information there, is there a way to get the Chinese character set translated? * When did these failures occure?

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