Specifying Surface finish on a BGA Module| 28 April, 2003
Can anyone help me with a problem I am encountering on specifying the surface finish on a new BGA System in Package module. So far I have been advised to look at a palladium / nickel / gold solution but does that have any advantages over nickel / gold process. It seems more costly.
Specifying Surface finish on a BGA Module| 30 April, 2003
ENIG is a common solderability protection on BGA packages.
Pd/Ni/Au while more expensive could have advantages over ENIG in the following area: * Allow both gold and aluminium wire bonding * Better solder resist compatibility (63�C max) * Might take multiple solder operations better