Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


BT material properties

C. M. Gabel

#23184

BT material properties | 28 January, 2003

I am working with a BGA package. The laminate layer is being modeled as BT-Cu smear. The thermal conductivity of BT is 0.19 W/mK. Does anyone know what the density and specific heat values are for BT?

reply »

#23225

BT material properties | 2 February, 2003

Mitsubishi Gas & Chemical's Bismaleimide-Triazine (BT) resin laminates are the defacto standard material for BGA. Have you checked with them?

reply »

Boundary Scan

Plasma Prior to Conformal Coating