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Concerned with processing 0.75mm c-c Pitch BGA

Kevin Facinelli

#22928

Concerned with processing 0.75mm c-c Pitch BGA | 7 January, 2003

I have a client interested in using a Toshiba Part P-TFBGA48-0607-0-0.75AZ. Mechanical data on the part can be found at:

http://www.toshiba.com/taec/components/Datasheet/51WHM516AXBN.pdf

I am concerned with being able to use this part with consistent results. The ball size is .043 +/- .05mm and pitch between balls is 0.75mm. Does anyone have experience processing this part?

Please would like to discuss with someone with experience at this BGA pitch.

Thanks,

Kevin

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RDR

#22929

Concerned with processing 0.75mm c-c Pitch BGA | 7 January, 2003

What exactly are you concerned about? This is from what I can see a pretty standard part (30 mil pitch, 17mil ball). Sorry, I have to convert to inches for my weak brain to work! This part should process very well.

Russ

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#22935

Concerned with processing 0.75mm c-c Pitch BGA | 8 January, 2003

As Russ says this should process well the BIG BUT..T is what are you using to process this part! How old / capable is your equipment. Screen print quality is a must. Placement accuracy is critical and reflow stability is important. So the answer is does your factory have the technology to assemble parts with that pitch! If the answer is yes proceed on with confidence.

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mk

#22945

Concerned with processing 0.75mm c-c Pitch BGA | 9 January, 2003

Consider ssd. Eliminate paste application. No printing necessary. www.sipad.net mk

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#23036

Concerned with processing 0.75mm c-c Pitch BGA | 16 January, 2003

hi, I have experience in placing BGA's with this pitch and it's OK.Tell me more about your problem(printing ,placing, accuracy rotation) or whatever ti is.

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