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Flip Chip assembly without underfill

#22915

Flip Chip assembly without underfill | 6 January, 2003

Hi all, Can anyone give me more info about Flip Chip assembly without underfill.Some technics,necessary equipment(optics,linear motors,accuracy and so on)or where i can read about it.

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#22930

Flip Chip assembly without underfill | 7 January, 2003

The following book has several chapters on various [ie, flow, no-flow, etc] underfils that could help you: Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies; John H. Lau; McGraw-Hill Professional; ISBN: 0071351418; 1st edition; 2000

The book also discusses the early IBM C4 technology that required no underfill.

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MA/NY DDave

#22933

Flip Chip assembly without underfill | 8 January, 2003

Hi

Another add,

This depends on your application environment.

If you have levels of shock and vibration or high thermals underfill is needed.

YiE, MA/NY DDave

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