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REFLOW: Insulating a Power Brick Device

C.K.

#3316

REFLOW: Insulating a Power Brick Device | 14 August, 2000

We've got this power brick device with a Copper casing that gets so hot in the oven, that the solder on the circuit board inside the power brick reflows. Of course, the heat is abosorbed by the case.

Profile adjustments have been tried, but we don't want to have to sacrifice the profile by running it too fast or too cold - else, we'll run into a slew of other problems.

Does anyone know of a manufacturer who makes a heat insulator cover for components?

(I'm envisioning something similar to that orange cover that goes over a WinKic datalogger).

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#3317

Re: REFLOW: Insulating a Power Brick Device | 16 August, 2000

Hello CK Do I understand you correctly that you are reflow soldering a copper case containing a previously assembled PCA? Insulation would seem to pose a few problems that would need to be passed on by the design engineer. 1. Keeping the heat of reflow out would necessarily keep the heat of the PS in. How would this affect reliability? 2. If the power supply is line connected the insulation would need to meet a number of safety and flamability standards as in UL and European Union standards. 3. The tooling and other NRE for a molded cover would be high. How about a low temperature solder for the case and/or a high temperature solder for the PCA? Good luck John Thorup

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#3318

Re: REFLOW: Insulating a Power Brick Device | 21 August, 2000

Hey CK: I do not know who makes the "orange cover that goes over a WinKic datalogger". Maybe someone at KIC can give you a source. Further, John makes good points.

Have you talked to your power brick whatever supplier?

Alternately, consider using reverse thermology, during reflow: * Place a temporary heat sink on the power brick device * Place a temporary metal cover over the power brick device

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