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type 4 paste & type 5 - environment factors & process parameter?

iman

#22386

type 4 paste & type 5 - environment factors & process parameter? | 13 November, 2002

does anyone know what environment factors(specifications?) and process control parameters(printer & reflow?) are optimal for running SMT using type 4 and type 5 solder paste respectively? Any pitfalls to avoid?

The product we have been asked to use is a 170mm x 210mm panel with 32 individual cells, each cell having 2 SOIC, 1 uBGA, and cuppa RES & CAPs (total : 27 parts each cell).

PS: Yeah, we know of the "speak to the sales guys selling us the paste" and "follow supplier recommended specs" routine. however, we most truly value the expertise and wise advise posted here in the fine SMTnet forum. Thanks.

Also we came to know from our off shore SMT associates, about the KESTER Hydromark 522 paste (WS?), and saw some reference to it in the SMTnet, just how good is it? and any unique soldering process considerations that must be addressed during use? how about any cleaning (WS?) needs *hint: ionic contamination level verifications?*?

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