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Dye Pry test

Yngwie

#22099

Dye Pry test | 23 October, 2002

Guys what is the diff. between Dye Pry test vs cross sectioning, and how is it done ?

Thank you..

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#22103

Dye Pry test | 23 October, 2002

Not familiar with "Dye Pry test".

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Terry Burnette

#22115

Dye Pry test | 23 October, 2002

Dave, we're about to publish a paper in Advanced Packaging mag. on the use of dye penetrant testing. Educate me on how to enclose the paper on this web site and I'll be glad to let everyone review it.

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Randy V.

#22116

Dye Pry test | 23 October, 2002

Dye penetrant is a liguid that will wick through very small cracks. I used over 10 years ago for checking cracks in glass feedthru's in hermetic packages. You put the dye on one side of the seal and developer (white) on the other side and the red dye shows up when it comes through the crack. If you cross-section a part like glass you may induce other fractures that were not there before. It all depends on the part and what you�re looking for. Cross sectioning is also destructive.

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Brian Doyle

#22117

Dye Pry test | 23 October, 2002

Hi Terry,

You can post the article in the library component on the site. If you also send it to me via email (bpdoyle@smtnet.com) I'll look it over for next month's express.

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Yngwie

#22131

Dye Pry test | 24 October, 2002

thanx Randy..

But Terry how can I get the chnace to look at the paper that you are going to publish.

thank you.

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Terry Burnette

#22136

Dye Pry test | 24 October, 2002

I've been informed that I can't post the Dye Penetrant paper on the SMTNET library till Advanced Packaging releases the paper in their Dec. issue. You should be able to pull a copy in the next couple of weeks from their site, http://ap.pennnet.com/home.cfm I can give you a summary explanation. Dye penetrant analysis is a technique used to find open solder connections and fractures on devices such as BGA and DCA. It's a relatively simple technique which involves injecting a red dye, such as ITW's Dyekem DX-296, under a BGA which has suspect solder connections. After injecting the dye, cure in a bake oven at 100C for 30 minutes. After curing, flex or bend the PCB in order to break all of the good solder connections. After breaking the good connections, pry off the BGA. Any solder joints or traces that were originally open will show red. The joints that were good will either show normal solder gray coloring or in many cases actually pull the Cu PCB pads out and show copper color. There are numerous reasons for open joints on BGA. PCB pad Ni/Au separation, non adhesion to the applied solder on the PCB, intermetallic fractures at the BGA substrate solder pad, etc. In the Advanced Packaging article we've loaded numerous pictures to show the appearance of the different failure mechanisms. Even though this is a destructive test, it does provide a very quick method for finding the root cause of grid array soldering problems.

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Yngwie

#22152

Dye Pry test | 25 October, 2002

Terry, thank you very much...& hv a nice weekend.

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