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Standard for BGA void

Ben

#22050

Standard for BGA void | 21 October, 2002

I'm doing lead-free SMT of BGA with 450 micron ball. I found there are lots of voids under xray, there are around 2-3 voids in every balls. It is around 10% of volume ratio. I would like to ask if anyone know there is any standard of acceptable maximum void to solder ratio, like Jedec or other SMT standard??

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#22053

Standard for BGA void | 21 October, 2002

IPC-7095 has wording like: I. Void in ball ||Class1|| Accept|| Reject ||||60% of ball diameter|| >60% ||||36% of ball area|| >36% ||Class2|| Accept|| Reject ||||45% of ball diameter|| >45% ||||20.25% of ball area|| >20.25% ||Class3|| Accept|| Reject ||||30% of ball diameter|| >30% ||||09% of ball area|| >09% II. Missing Ball: This is prohibited, any evidence is reject. III. Short ball / Bridging: Any evidence is reject. IV. Open ball: Any evidence is reject. V. Popcorning: Any evidence is reject

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Ben

#22054

Standard for BGA void | 21 October, 2002

thanks for ur help. i would also like to know the classes is for showing different level of requirement, or for different vertical location of void in joint. coz I heard from my workmate that the range from 9% to 36% is for void at different vertical locations.

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#22113

Standard for BGA void | 23 October, 2002

Hi Ben,

IPC610 has a pass/fail of 25% of ball volume.

Hope this helps

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