Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

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PCB finish requirement for COB process

andy

#21737

PCB finish requirement for COB process | 24 September, 2002

For the COB process, what thickness for plating Au is suitable? IS there any specification for this issue?

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andy

#21738

PCB finish requirement for COB process | 24 September, 2002

we used the ball bonding, just normal chip on board.

as I know the the electroless Ni/immersion Au, the gold thickness is about 0.13um at most, what about chemical plating or electrolytic plating?

any experience on it, thanks

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POC

#21778

PCB finish requirement for COB process | 27 September, 2002

I spec COB using wire bond attach - 0.75um � 0.25 Gold over 5um � 3 Nickle.

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#21780

PCB finish requirement for COB process | 27 September, 2002

Mar,

The previous post makes the best point. Your finish spec depends on the COB process you plan to use. Is your process: * Gold wire bond * Aluminum wire bond * Flip chip * Er, watt

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