SMT electronics assembly manufacturing forum.
For the COB process, what thickness for plating Au is suitab... - Sep 24, 2002 by andy
we used the ball bonding, just normal chip on board. as I... - Sep 24, 2002 by andy
I spec COB using wire bond attach - 0.75um � 0.25 Gold over ... - Sep 27, 2002 by POC
Mar, The previous post makes the best point. Your finish... - Sep 27, 2002 by davef