Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


via in Pad

Yngwie

#21576

via in Pad | 17 September, 2002

Hi all Experts,

Desperately need your help on the following questions on Via in Pad and want to understand each of them wrt :

- complete Via in pad - partial encroachment - via partially in pad

1) What is the general feel for via in pad for upcoming designs?

2) What are the manufacturing bare PCB's related concerns, issues and possible drawbacks for using via in pad?

3)What are the assembling PCB's related concerns, issues and possible drawbacks for using via in pad?

4) Will solder flow thru. the vias and cause solder balls on the other side? Please explain different scenarios from your experience.

5)Are there any reliability concerns and known issues?

6)Will there be any possible manufacturing related issues regarding solder volume and tombstoning? Please provide any data that is available.

7) Please provide different graphical views of possible via in pad solutions if you are aware of with design rules.

8) What are the pad sizes we should avoid via in pad for?

9) Is it okay to lose soldermask dam using via in pad? Does this lead to cold solder joints?

Thanx in Advance...

yngwie..

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#21580

via in Pad | 17 September, 2002

Try: "Increasing Density By Placing Vias In Lands"; Blankenhorn, JC; 'Printed Circuit Design'; 11/98

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Yngwie

#21581

via in Pad | 17 September, 2002

Thanx for the proposal...but Dave I'm not able to link to PCD's Sites past issues 11/98, that you were suggesting. Is there anyway that I can get a copy of the said articles ?

Appreciate your help and thank you in advance...

cheers.. yngwie

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#21595

via in Pad | 17 September, 2002

Contact: * PCD Magazine [ http://www.pcdmag.com/mag/reprints.html ] and ask them to send you a reprint. * Jim Blankenhorn [ http://www.smtplus.com ] and ask him to send you a reprint.

Or try: * �Assembly And Interconnect Reliability Of BGA Assembled Onto Blind Micro And Through-Hole Drilled Via In Pad�; Andrew Mawer; Motorola Semiconductor Product; Surface Mount International; 08/23/1998 * �Design And Assembly Factors For 0201 Components�; Christina Piasky; IBM Corp.; Pan Pacific Symposium; 02/13/2001

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Yngwie

#21607

via in Pad | 17 September, 2002

Thank you Dave.

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