Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.

Non-contact jet-fluxing

Daniel Woon


Non-contact jet-fluxing | 20 August, 2002

I notice that dip fluxing method is commonly used in flip chip assembly (FCOB, FCOC and FCOF). Main reason: better flux control.

How about spray fluxing (e.g. the non-contact jetting technology from Asymtek)? Does anyone has experience adopting this method in flip chip assembly before? Any information is very much appreciated.


reply »


HeatShield Gel- thermal PCB shield during reflow