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I notice that dip fluxing method is commonly used in flip ...
- Aug 20, 2002
Non-contact jet-fluxing | 20 August, 2002
I notice that dip fluxing method is commonly used in flip chip assembly (FCOB, FCOC and FCOF). Main reason: better flux control.
How about spray fluxing (e.g. the non-contact jetting technology from Asymtek)? Does anyone has experience adopting this method in flip chip assembly before? Any information is very much appreciated.
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