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SMT electronics assembly manufacturing forum.


Simultaneously Double side reflow

FRANKY

#21177

Simultaneously Double side reflow | 15 August, 2002

Hi all ; Anyone have the experience with the double side reflow at the same time both top and bottom ? I want to know the description of this process and the possibility of this process ,or could you suggest me the source or contact person of this topic. Thanks

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#21180

Simultaneously Double side reflow | 15 August, 2002

The fine SMTnet Archives have a couple of threads on double side reflow.

Bob Willis Technical, Director, SMART Group, produced a Charity Report on the specific process of Double Sided Reflow Assembly. You can get the report from the SMTA [ http://www.smta.org ] or Mr. Willis [Electronic Presentation Services, 2 Fourth Avenue, Chelmsford, Essex CM1 4HA England (44) 01245 351502 Fax: (44) 01245 496123 eps@bobwillis.co.uk http://www.bobwillis.co.uk/ ]. Bob says all the money from the sale of the report goes to the Charles Hutchins Scholarship Fund run by the SMTA.

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Matt Kehoe

#21192

Simultaneously Double side reflow | 16 August, 2002

SIPAD solid solder deposit and glue dots is an excellent solution.

www.sipad.com

Matt Kehoe SIPAD Systems Inc

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FRANKY

#21223

Simultaneously Double side reflow | 19 August, 2002

> SIPAD solid solder deposit and glue dots is an > excellent solution. > > http://www.sipad.com > > Matt > Kehoe SIPAD Systems Inc

Thank you for your information , but I would like to know the information of normal process like a flip process but don't use special tooling or new process. Do you have the information about the holding force of raw solder and the molten solder with the component ?

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#21234

Simultaneously Double side reflow | 19 August, 2002

Bob Willis and Phil Zarrow have had a running commentary on the ability of reflowed solder to hold components on the bottom side during reflow. You can find references to their component weight to pad area rations in the fine SMTnet Archives.

The ability of raw solder to hold components while upside down is a function of: * Tack of the specific paste * Weight of the component * Surface area of the pads

� Aside from the Bob Willis discussion, mentioned in an earlier posting to this thread, I can�t recall other discussion on the �holding force� of raw paste. Could you start by looking in the back issue listings of some of the trade journals, like �SMT� and �Circuits Assembly�?

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