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VIA HOLES ON SOLDER PAD

Computer

#21063

VIA HOLES ON SOLDER PAD | 6 August, 2002

Hi ,

I am currently faced with a problem with the via hole on the component pad. The customer does not allow plugging of the hole and enlarging the stencil pad hole size or thicker stencil size may cause bridging to the component next to it. Additional solder volume may also cause excessive solder to flow out from the via holes. Any suggestions ??

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#21065

VIA HOLES ON SOLDER PAD | 7 August, 2002

Search the fine SMTnet archives on this subject. There is a lot of info.

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