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Die placement with MPA-G3 pick and place

Jim M.

#20253

Die placement with MPA-G3 pick and place | 6 June, 2002

Has anyone had much luck Picking and Placing die with a Panasonic MPA-G3?What special setups or considerations are required?

Currently we pick and place one die with our Universal GSM using only one nozzle. The nozzle must be painted white in order to offset the lighting.I must keep the GSM in the SMT room in line with the HSP for any parts that come in tubes or waffles.

I have access to an MPA-G3 and would like to utilize it in our cleanroom so as to prevent all the handling of pick and placing in the SMT room, then moving the boards into the cleanroom for wirebonding.

The die are received in waffle packs.My one other though is would the die be easy to program for pick and place on the MPA-G3 and is there a special nozzle available/needed? The die might not be passivated so consequently will be very soft and easy to scratch.

What is the smallest die width and length the MPA-G3 could handle?

Thanks for any help.

Jim M.

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CAL

#20254

Die placement with MPA-G3 pick and place | 6 June, 2002

Jim- Sorry I can not offer advice on the Panasonic machine but do want to shed light on the Die and waffle pack issue. Take note that if the Die are loose in the pockets the balls or terminations could be damaged. The thin layer that the ball is attached may not be strong enough to endure the chafing. Hopefully your tolerances are minimal to keep the die from moving around a whole lot. obviously this also depends on the die structure.

Cal

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