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Epoxy Push Test Specifications

Nell

#20106

Epoxy Push Test Specifications | 29 May, 2002

Hi,

Does anyone know about the epoxy push test specifications for the SMT chips component. For example: 0603, 0402 and 0201 chips.

As usual, your help is very much appreciated.

Thanks in advance, Nell

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Hussman69

#20111

Epoxy Push Test Specifications | 29 May, 2002

You mean the destructive test were you continually push on a part until it breaks free from the board and flies across the room?

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#20132

Epoxy Push Test Specifications | 29 May, 2002

We have talked about testing the cure of glue, epoxy holding secondary side compomponents in place prior to wave soldering several times here on SMTnet. Search the fine SMTnet Archives, if that's what you're seeking.

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Hussman69

#20146

Epoxy Push Test Specifications | 30 May, 2002

Ooops, my bad.

"Curse your eyes Nell, for even asking a question on this forum. Check the archives before we put a curse on your adhesive process and force you to ask another question!"

Whew, hope that made up for my mistake.

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#20150

Epoxy Push Test Specifications | 30 May, 2002

Slappy

The level of rightous indignation is well done, but sarcasm seems a bit overdone. Just a twinge of it would have been fine. Needs some work. Good shot at it though.

Yano, maybe the 'cursing of eyes' bit was a little over the top also. Possibly just a cursing of the left rear tire would have been sufficient.

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Hussman69

#20152

Epoxy Push Test Specifications | 30 May, 2002

Sorry Nutty.

But then again, this coming from a guy who used to answer in Ebonics, makes me wonder why.

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