Additionally, �DFM For Through-Hole Technology� [Vivek Sharma, Printed Circuit Design, 1/01, p 14-20] is a good general point of reference.
Finally, 2221, 8.3.1 Leads Mounted In Through-Holes says, �Requirements for lead-to-hole relationships are detailed in 9.2.3 through 9.3 of the related design sectional.� This makes sense because you�d expect that relationship to change according to the type of board [ie, rigid organic, flexible, etc].
As an example, 2222, Table 9-4 Plated-Through Hole Aspect Ratio has the information you seek for rigid organic boards. Leading-up to that table, 2222 goes into a rather involved discussion on the proper gap between lead and hole according to product class. This is too burdensome to discuss here and not knowing the type of board you�re designing or the equipment class could be a waste of time anywho.
Consider obtaining the section design standard for the type of board you are designing to compliment and expand on 2221.