Insulated Metal Substrate Pcb's - "Thermal Clad"| 24 April, 2002
Our design group is looking at using a IMPCB material for a power amplifier design. They would like to to use this because of it's excellent thermal properties. This would be used to create a "SIP" module that would plug into a std FR4 pcb with the control circuitry on it. I have a few questions in regards to manufacturing with this type of material.
1. Will a standard reflow oven work? 2. Are multi-up panels possible or is one-up the only opt? 3. Any special rework considerations ? 4. Any special Pad/trace layout requirements ? 5. Is a special Flux or Solder Required ?
I have some sales literature from our PCB vendor but, it paints a pretty rosy picture. If I say yes to the design team I want to go into this with more than just the sales info.