Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


High Aspect Ratio Via Fills

Habs24

#19401

High Aspect Ratio Via Fills | 5 April, 2002

Anyone have experience using Dupont CB100 for high aspect ratio via fills? Or even where I could get more information on the processes involved? Thanks in advance...

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davef

#19403

High Aspect Ratio Via Fills | 5 April, 2002

Conductive Silver Epoxy Holefill Process Dupont CB100 (Note: Dupont Recommendations) * Board Thickness: 0.008" to 0.085" * Drilled Via Size: 0.008" to 0.018" * Aspect Ratio: 1:1 to 6:1

On learning more, try: * http://www.ipc.org/html/S17-4a.pdf * Dupont

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