Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.

Flux encapsulant

Daniel Woon


Flux encapsulant | 1 April, 2002


Heard about flux encapsulant - a compression-flow flux and underfill product for flip chip assembly. It eliminates the need for a separate underfill operation.

Does anyone has experience in actual production run? What is the possible effect for flip chip with pitch 0.5mm and small bump size (0.17mm) and large bump size (0.3mm)?

Does the type of substrate affect the flux encapsulant process also? For example, organic (BT), ceramic (LTCC), flex (polyimide) substrate?

Thanks and regards,


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Flux encapsulant | 2 April, 2002

No experience, but here's a contact

They may be able to give you leads, if someone here doesn't.

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