Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

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BGA lands and ICT

#19185

BGA lands and ICT | 19 March, 2002

Does anyone have or know of any published guidelines for BGA layout on PWB's so that they can be tested. Specifically using micro vias? If anyone has any input regarding other test considerations for BGA devices I'd like to hear from you as well.

We are just getting into BGA's and the pitch of via's is presenting a problem for our ICT bed of nails.

Thanks, Robert C.

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#19189

BGA lands and ICT | 20 March, 2002

Purchase: 7095 - Design and Assembly Process Implementation for BGA's

Make every effort to distribute the test pads, because if you keep them massed at the ball, it would be a bijundo kick in the BGA rear section, when all of those pins released.

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#19205

BGA lands and ICT | 20 March, 2002

You may want to check out IPC-SM-782 "Surface Mount Design and Land Pattern Standard" http://www.ipc.org

Good Luck

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