Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


SOLDER AND REWORK OF BGA

MSP

#19102

SOLDER AND REWORK OF BGA | 8 March, 2002

I manufacture industrial ink jet printers. I have a new application to join an unpopulated flex circuit to a light ly populated PCB. Production requirements are rather low. The area To join is 300 solder balls on the flex occupying an area of 5/8 inch by 3 inch. This area also needs to be unsoldered and flex removed when rework opportunities arise. Any ideas on the best way to do this? I have hot bar bonders available but bar size appears to be a possible problem. Appreciate any help.

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John Z.

#19168

SOLDER AND REWORK OF BGA | 18 March, 2002

I suggest speaking with the people over at Circuit Technology Center. If your rework requirements are low, it may be cost effective to out source. http://www.circuittechctr.com

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