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Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


SMT Line Test

Yannick

#18657

SMT Line Test | 16 January, 2002

Hi,

In few weeks I want to test the capabilities of our SMT Line. To do that I'll design a board. I want to test:

- The Printing - The component placement - The soldering - Different stencil aperture - Mixed Technology (Throught Hole and SMT)

I'll do my test with 0603,0402,0201,Fine Pitch, BGA and etc.

Does anyone have performed this kind of test?? What sould be aware of before the beginning of my test??

I know that some compagnies sold a Test kit but they seem to just have component on it, no traces or vias is this better or not??

I would like to be in contact with someone who can help me to have a good preparation.

Thanks You

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#18658

SMT Line Test | 16 January, 2002

Try Heraeus. They have a nice PCB designed for what you are looking for. Its called the Benchmarker1. Designed specifically for Paste evaluation, but you can use it to test placement as well. No traces on the PCB, although I don't really see why you would need them anyways.

Phil

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#18663

SMT Line Test | 16 January, 2002

Yannick, I have been involved in a stencil consortium that looked at stencil design, technology, and paste as variables. This material will be presented at APEX 2002 in San Diego next week. This work was done by Rochester Institute of Technology in ROchester, NY. Please contact me at jhingtgen@dek.com for further contact info.

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#18665

SMT Line Test | 16 January, 2002

The Industry has just come out with some standard that includes a "test board" that will be used to compare one machine to another (we have been refering to it as an IPC board). The board has components spaced from a smaller to larger pattern and at various angles so that one machine will not have an advantage over another. I'm sure someone else that reads this can give some more info. With this board you can compare one machine to another on an equal playing field.

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Terrapin

#18670

SMT Line Test | 16 January, 2002

The standard - not agreed on by all - is IPC-9850. This has been adopted by most major players

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#18674

SMT Line Test | 16 January, 2002

Comments are: * Some people use calibrated boards and components to remove sources of variation when using their CMM to measure placement accuracy. Sources of supply are listed in the fine SMTnet Archives. * It�s unclear that a single board will meet the assessment requirements of diverse types of equipment. * What is the point of �traces or vias� on a board used for assessing the capability of a printer or a pick & place machine? * Some suppliers offer services like these for their machines. * Developing meaningful statistical measures on so many components [ie, 0603, 0402, 0201, fine pitch, BGA and etc.] could be very expensive. Consider limiting yourself to fine and course pitch or BIG and small. * How do you plan to measure the capability of �Different stencil aperture�? And what�s the point? * How do you plan to measure the capability of �Mixed Technology (Throught Hole and SMT)�?

This sounds like someone read something about quality assessment and said �Yannick what is the capability of our SMT line?� As you�ve laid this out, you have got one BIG-assed job in front of you to do every year. Why not just say, �For a range of boards that have 0603, 0402, 0201, fine pitch, BGA and etc. components; this is a X [Er whatever X really is � ] DPMO line.�? And be done with it.

For Christmas mom bought me �Statistical Procedures for Machine and Process Qualification� Dietrich / Schulze, American Society for Quality 1999 [0873894472]. [Better than a sweater.] I can�t comment on it, but you can assume ASQ probably did a reasonable job of assessing the book and it�s in the third edition.

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#18684

SMT Line Test | 18 January, 2002

DOE?

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Yannick

#18695

SMT Line Test | 21 January, 2002

The point behind traces and vias on my test is that I don't only want to perform test on printing and placement but on reflow too, so a board with many components and no trace will not react like a board with traces on it. Unless you or someone else can prove me that I'm wrong. I want to test differents stencil apertures to find maybe 2 or 3 kind of apertures that we will help us to always have enough solder paste and will keep us away from problem like: solder balling, solder beading, etc...

I think that you have a good idea with your sentence "For a range of board that have...." but without a test how can I say such thing?? I can't do that with only the machine specs or some rules made by orgagnisation like IPC....

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