Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


ACF Process

Daniel Woon

#18506

ACF Process | 23 December, 2001

Does anyone has experience in ACF (anisotropic conductive film) process? What is the typical bonding pressure/force/temperature for FCOG (flip chip on glass)?

Will the glass crack when a high pressure applied during flip chip placement?

Thanks and regards,

Daniel

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#18559

ACF Process | 3 January, 2002

(Anisotropic Conductive Film) http://www.itousa.com/AAL_Overview.htm

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