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BGA solder ball composition

Cheng

#18198

BGA solder ball composition | 19 November, 2001

The BGA solder ball composition is 62/36/2 Sn/Pb/Ag,

does any problem exist for the solder joint reliability?

And

what is the difference on SMTA process between this and the normal 63/37 ball?

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#18201

BGA solder ball composition | 19 November, 2001

Git otta taun!!! I never have heard of an Sn62 BGA solder ball.

Several thoughts on Sn62: * Look at http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=4603&#Message17953&

* Search the fine SMTnet Archives on � Sn62 � 62Sn � 2% Ag � 2% silver � 2Ag � etc.

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