Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

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BGA solder joint VS. X-Ray machine capability

Nopporn

#18140

BGA solder joint VS. X-Ray machine capability | 12 November, 2001

Dear all I 'm looking the minimum X-Ray machine capability that is capable to inspect the solder joint of BGAs, Fine pitch BGA and CSP such as open, poor solder joint ,etc... What is the machine specification needed? Thank you for your advise.

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Mr.T

#18141

BGA solder joint VS. X-Ray machine capability | 12 November, 2001

HI,

I would say around 80Kv 5-8um focalspot should be OK. Check systems like CR Technology,Phoenix,FeinFocus these are nice systems. There is low cost system Glenbrook any good I do not know.

Good luck, MadReindeer

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V Butani

#18146

BGA solder joint VS. X-Ray machine capability | 12 November, 2001

You can get systems at various performance levels depending on your budget. The low cost systems are a great way to start off and then you can upgrade to a higher performance unit when you move to finer pitch components. Check out the VJ-1000LP at http://www.vjt.com/electronix.

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CAL

#18147

BGA solder joint VS. X-Ray machine capability | 12 November, 2001

Your broad question will bring many answers.You do not mention PCB type which plays a key part in the inspection specs you look for. Your question is like asking "What is the best automobile?" You will have 1,000,000 answers. Best answered this way: GO/No-go Machine specs: 50Kv, limited zoom, perpendicular head, board size. Low to mid range machine:+75Kv, Angular inspection,zoom,image capture, board size. Mid to High machine: +90Kv, Rotating/angular inspection ,zoom, image capture, image processor sw, pass through capable, board size.

Hopefully I answered your question.

Cal Manncorp

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gzweig

#18174

BGA solder joint VS. X-Ray machine capability | 14 November, 2001

This question and other issues on x-ray inspection of BGAs are addressed in the free PDF. publication available by e-mail entitled: Rapid and Effective X-ray Inspection of BGAs using "Signature Identification" Just place "send publication" in subject line and e-mail to: gzweig@glenbrooktech.com

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Jamstart

#18179

BGA solder joint VS. X-Ray machine capability | 15 November, 2001

I think for x-ray, it really depend what package you are looking at. For CSP, it should be at least min 90KV, min 5 micro focus size. CSP definitely need a higher mag and resolution.

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PCB equipment

PCB X-Ray Inspection System