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The specification of Paste deposition thickness and volume

Stoney Tsai

#17667

The specification of Paste deposition thickness and volume | 21 September, 2001

Guys,

If there are any specifications or ciriterions for solder paste deposition thickness and volume evaluation.

For example, QFP (0.5 mm pitch), 6~8 mils, 3000 mil^3 PLCC: 8~10 mils, ... . . Thanks in advance. Best Regards, Stoney Tsai

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#17670

The specification of Paste deposition thickness and volume | 21 September, 2001

Not as such. Look at IPC-7525 �Stencil Design Guidelines�

The issues are: area and aspect ratios. They relate the size of the aperture opening to the thickness of the stencil. Check the fine SMTnet Archives for guidelines.

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