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Nitrogen V.S Solder bridging problem

Por

#17446

Nitrogen V.S Solder bridging problem | 1 September, 2001

Hi guy Please help advise me the impact of using Nitrogen to solder bridging defect. I heard somebody said that using nitrogen can effect the bridging problem by higher surface tension in case inaccurate printing . Is it true? Thanks.

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Steve

#17498

Nitrogen V.S Solder bridging problem | 6 September, 2001

I may be wrong, but I'm thinking that nitrogen has less effect on solder bridging as does the amount of solder that is present. Nitrogen allows better wetting becasue there are no oxidation effects.

If you have solder bridging problems, look at the size of the stencil apertures

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Hussman

#17510

Nitrogen V.S Solder bridging problem | 7 September, 2001

Por,

You talking wave solder or reflow solder?

At wave, nitrogen is the way to go. Just like you stated, it does affect the surface tension.

If you're reflowing, I wouldn't go nitrogen unless you have to. Improper stencil design is usually the cause of solder shorts (assuming you are placing correctly).

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#17535

Nitrogen V.S Solder bridging problem | 9 September, 2001

For reflow soldering, you are correct !

The higher surface tension of the solder paste in nitrogen atmosphere can increase the number of solder bridges if the component or solder paste print is inaccurate. Another defect that might increase is tomb stoning.

Despite these failures I found that using nitrogen in reflow soldering gives more benefits.

For more info check out my web site: http://www.smtinfocus.com/paper_nitrogen.html

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