Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Henry Lee

#16803

Wavesolder process characterization | 29 January, 1998

I have an Electrovert Ultrapak 445 Wavesolder machine with 3 IR preheat zones and a single wave with omega wave. I want to run a DOE (Taguchi) to determine the optimum settings for soldering both single-sided and double-sided boards. Can anyone point me to information or a guide from someone who has performed this experiment (I know people have done this). Of course I'll have to run my own experiment, but it would be helpful to identifies the sensitive process variables. (I'm thinking the preheat temps., solder temp., conveyor speed, omega agitation...) Thanks - Henry Lee

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Earl Moon

#16804

Re: Wavesolder process characterization | 19 February, 1998

| I have an Electrovert Ultrapak 445 Wavesolder machine with 3 IR preheat zones and a single wave with omega wave. | I want to run a DOE (Taguchi) to determine the optimum settings for soldering both single-sided and | double-sided boards. Can anyone point me to information or a guide from someone who has performed this | experiment (I know people have done this). Of course I'll have to run my own experiment, but it would be | helpful to identifies the sensitive process variables. (I'm thinking the preheat temps., solder temp., | conveyor speed, omega agitation...) | Thanks | - Henry Lee Relationships are flux composition, flux density (sg checked with hygrometer), flux application, preheater temperature, conveyor speed (3-6 feet per minute only varied with preheater temp change to effect top side ramp up) top side board temperature (activate flux and precondition board before wave to avoid thermal shock measured only with infrared pyrometer or mole) wave solder compositon (minimal specified contaminate levels only), wave temperature (495 + or - 5 degrees F., as an example), wave contact time (1.5 to 3 seconds only), wave contact area (parallel at 1-2 inches checked with Hexacon Lev-Check glass plate), pcb quality (x-sectional analysis before and after thermal stress with cured epoxy solder mask using methylene chloride test), and board preconditioning to prevent moisture entrapped outgassing. Determine solder joint quality and correlate effect with cause (overall) individual elements indicated (usuall top side temp, conveyor speed, etc.). Derive statistical data and convert to useful information then create matrix to various board types (thermal mass as example).

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Reflow Ovens thermal process improvement

Fluid Dispense Pump Integration