Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.

Brian S. Bentzen


Cooling rate after reflow soldering | 13 February, 1998

Hi , The 4th stage in reflow soldering, the cool-down, I find is often over looked. A rapid cooling rate should give finer lead and tin structure with more bindings and thereby result in stronger solder joints. Can anybody give me some information concerning the recommended and maximum cooling rate. Thanks! Brian S. Bentzen

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