Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


John Wilson

#16745

solder sphere and weight issues | 17 February, 1998

I am looking for any information or testing data done on the amount of weight that can be held by a bga package based on size of the solder sphere and number of spheres. I am reflowing components with a bga package on the opposite side and looking for data.

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PCB X-Ray Inspection

Plasma Prior to Conformal Coating