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Printed Circuit Board Assembly & PCB Design Forum

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BGA removal

Craig Fernandes

#16674

BGA removal | 23 February, 1998

Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process.

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Mike

#16679

Re: BGA removal | 23 February, 1998

| Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. Depending on your rework station,Useing a Mole or Kic profiling tool, (on scrap boards), drill a small hole next to a BGA pad (center of part) and attach a tc to the pad with high temp solder. Place a bga on the pads, this setup can be used to determine the best profile. 1) run a bead of paste flux around the BGA 2) preheat board to 100 c 3) Try to use a profile that will closely match your reflow profile Ramp, soak, spike,(remove) and cool. Replace Remove solder from pads Coat the bga area with paste flux (20-30 mill) Place bga Repeat profile from above (there is no nead to add solder paste if using 63/37 solder balls) Hope this helps Mike

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mike foley

#16676

Re: BGA removal | 24 February, 1998

| Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. Hi Craig, I have been researching BGA rework equipment for about two years and there is a range of equipment that can do the work you need. The best thing to do is call a PACE equipment rep. and ask for a demo. You can spend between $3200 and $40,000 on BGA rework equipment depending on what you want to do. My requirement are to remove, reball and reinstall, but just removing a BGA shouldn't be a problem. Good Luck Mike Foley

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Robert Joosten

#16677

Re: BGA removal | 11 March, 1998

| | Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. | Hi Craig, | I have been researching BGA rework equipment for about two years and there is a range of equipment that can do the work you need. | The best thing to do is call a PACE equipment rep. and ask for a demo. You can spend between $3200 and $40,000 on BGA rework equipment depending on what you want to do. | My requirement are to remove, reball and reinstall, but just removing a | BGA shouldn't be a problem. | Good Luck Mike Foley Yo !! Wait a minute !! Don't go to Pace; Call OK-international; ask for Paul Wood; he can tell you something about BGA repair and not only that; think about future problems!! Good luck !!

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Clyde F

#16678

Re: BGA removal | 14 March, 1998

| | | Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. | | Hi Craig, | | I have been researching BGA rework equipment for about two years and there is a range of equipment that can do the work you need. | | The best thing to do is call a PACE equipment rep. and ask for a demo. You can spend between $3200 and $40,000 on BGA rework equipment depending on what you want to do. | | My requirement are to remove, reball and reinstall, but just removing a | | BGA shouldn't be a problem. | | Good Luck Mike Foley | Yo !! Wait a minute !! Don't go to Pace; Call OK-international; ask for Paul Wood; he can tell you something about BGA repair and not only that; think about future problems!! Good luck !! I beg to differ! PACE has a BGA solution that starts at $3000. It's called the TF-500 ThermoFlo System. It's way above the low end stuff OK has. You should try out PACE's web page at www.paceusa.com -- you have to register, but it's worth the effort!

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Jon Gruett

#16675

Re: BGA removal | 27 March, 1998

AS the previous have stated there are several ways to get the BGA's off the board. Let me first ask you a couple of ?'s. 1)Are you concerned at all with the damage to the baord or the BGA? 2)Are you eventually going to need to consider the reattach process as a problem? If you don't consider it now and build it into your budget now then 'YOU WILL BE SORRY!! 3)Are your boards going to possibly get thicker with heavier ground planes? If that is even remotely possible then I suggest instead of concentrating on the low end equipment that could do what the immediate situation is then consider the next higher levels above that minimize the issues considerably. It will save you and your replacement tremendous grief. Just some thoughts. Good luck!!!! JON | Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process.

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Tony Arteaga

#16681

Re: BGA removal | 30 March, 1998

| | Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. | Depending on your rework station,| Useing a Mole or Kic profiling tool, (on scrap boards), drill a small hole next to a BGA pad (center of part) | and attach a tc to the pad with high temp solder. Place a bga on the pads, this setup can be used to | determine the best profile. | 1) run a bead of paste flux around the BGA | 2) preheat board to 100 c | 3) Try to use a profile that will closely match your reflow profile | Ramp, soak, spike,(remove) and cool. | Replace | Remove solder from pads | Coat the bga area with paste flux (20-30 mill) | Place bga | Repeat profile from above | (there is no nead to add solder paste if using 63/37 solder balls) | Hope this helps | Mike

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Tony Arteaga

#16680

Re: BGA removal | 30 March, 1998

Hello there, I am currently doing BGA repair and basically I am applying the same process as Mike sujested. It is actually the way to go when creating a profile. The next process is re-balling your package, that is if you whant to use the same component. I have the best method for re-balling BGA's. I would like to share it with you. E-mail me Thanks Tony A | | Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. | Depending on your rework station,| Useing a Mole or Kic profiling tool, (on scrap boards), drill a small hole next to a BGA pad (center of part) | and attach a tc to the pad with high temp solder. Place a bga on the pads, this setup can be used to | determine the best profile. | 1) run a bead of paste flux around the BGA | 2) preheat board to 100 c | 3) Try to use a profile that will closely match your reflow profile | Ramp, soak, spike,(remove) and cool. | Replace | Remove solder from pads | Coat the bga area with paste flux (20-30 mill) | Place bga | Repeat profile from above | (there is no nead to add solder paste if using 63/37 solder balls) | Hope this helps | Mike

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