Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Mike Mihld

#16630

Temp Profile for 0.05 pitch | 1 March, 1998

Can anyone advise a good starting point for a temp profile for on 0.05" and 1206 component boards? These boards are simple by todays standards and do not contain any fine pitch or other special components. Thanks in advance... MM

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Justin Medernach

#16632

Re: Temp Profile for 0.05 pitch | 2 March, 1998

| Can anyone advise a good starting point for a temp profile for | on 0.05" and 1206 component boards? These boards are simple | by todays standards and do not contain any fine pitch or | other special components. | Thanks in advance... | MM Mike, Several aspects affect the thermal profiling of a board. Among these are surface "density"(number and type of components), PWB thickness, oven style, and solder paste. There are probably others but I think I've touched on the majors. My advice to you would be to talk to your solder paste vendor and have them recommend a profile. these profiles are never carved in stone but at least they give you a place to start. Ask your salesperson to give you access to the solder paste company's chemist. These are the people whom you really need to grill. 9 out of 10 times, the sales person won't even know what you are talking about when you ask him for a solids content or whether or not the flux is resin based or a modified rosin. The next thing you need to do is pick up a thermal profiler. A mole, A KIC, Datapaq. there are several of them out there and all are pretty decent. You need one to generate decent profiles. Use this to determine the correct ramp up, soak, reflow, and cool down temperatures and times. Good luck and best regards, justin medernach flextronics international

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Scott McKee

#16633

Re: Temp Profile for 0.05 pitch | 2 March, 1998

| | Can anyone advise a good starting point for a temp profile for | | on 0.05" and 1206 component boards? These boards are simple | | by todays standards and do not contain any fine pitch or | | other special components. | | Thanks in advance... | | MM | Mike, | Several aspects affect the thermal profiling of a board. Among these are surface "density"(number and type of components), PWB thickness, oven style, and solder paste. There are probably others but I think I've touched on the majors. My advice to you would be to talk to your solder paste vendor and have them recommend a profile. these profiles are never carved in stone but at least they give you a place to start. Ask your salesperson to give you access to the solder paste company's chemist. These are the people whom you really need to grill. 9 out of 10 times, the sales person won't even know what you are talking about when you ask him for a solids content or whether or not the flux is resin based or a modified rosin. The next thing you need to do is pick up a thermal profiler. A mole, A KIC, Datapaq. there are several of them out there and all are pretty decent. You need one to generate decent profiles. Use this to determine the correct ramp up, soak, reflow, and cool down temperatures and times. | Good luck and best regards, | justin medernach | flextronics international I agree, the Solderpaste Chemist will be the one to ask. I use OMG Paste and the chemist hit the profile to the "T" for my more common boards. The more difficult boards I needed to profile though I used the on-board profiler with good success. Scott

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Brian Stumm @ ETS

#16631

Re: Temp Profile for 0.05 pitch | 5 March, 1998

| Can anyone advise a good starting point for a temp profile for | on 0.05" and 1206 component boards? These boards are simple | by todays standards and do not contain any fine pitch or | other special components. | Thanks in advance... | MM Be happy to help but don't know what oven you are using or number of zones your oven has. I work for ETS, manufacturer of Reflow Ovens. I would be happy to offer starting points if you tell me more about your equipment or I could also develop profiles for you if you send me a sample. Contact me by e-mail or by phone, 509-483-0900. Sincerely, Brian Stumm Thermal transfer consultant Reflow and curing

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