Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


baruch schiffmann

#16546

reflowing through hole components | 15 March, 1998

we are looking for paste printing specs.& stencils holes shapes to perform soldering reliability d.o.e. of the a.m. subject. looking forward to your info. tech. dept. /telrad prod.

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Justin Medernach

#16548

Re: reflowing through hole components | 16 March, 1998

| we are looking for paste printing specs.& stencils holes shapes to | perform soldering reliability d.o.e. of the a.m. | subject. | looking forward to your info. | tech. dept. /telrad prod. Call 1 800 4 INDIUM and ask for a sales person. A paper was done by employees of indium and Motorola on paste in hole processes. Ask for a copy of this paper and literature on the usage of their solder preforms to obtain adequate paste volume for a reliable solder joint. Regards, Justin Medernach Flextronics Int'l PIC East

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bob willis

#16547

Re: reflowing through hole components | 7 April, 1998

| we are looking for paste printing specs.& stencils holes shapes to | perform soldering reliability d.o.e. of the a.m. | subject. | looking forward to your info. | tech. dept. /telrad prod. For information on PIHR soldering there is a report, video and CD ROM check out my web site www.bobwillis.co.uk

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