Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

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Thermals on BGA vias to power plane

Stuart Adams

#16477

Thermals on BGA vias to power plane | 23 March, 1998

Should I use thermals or direct connects on vias from BGA pads to power planes. The via is connected to the BGA pad via a short 8mil trace.

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Earl Moon

#16478

Re: Thermals on BGA vias to power plane | 24 March, 1998

| Should I use thermals or direct connects on | vias from BGA pads to power planes. The via is | connected to the BGA pad via a short 8mil trace. Thermals are safest. However, I have had no problems using direct connects provided parameters are capable of preventing "thermal drain." Your description needs more clarification. Your specific parameters are (how long is 8 mil wide trace into how large a pad with what diameter via, with what distance to the reference plane)? Is there an electrical issue concerning your question?

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