Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


FR4 vs Polymide

Sherry

#15924

FR4 vs Polymide | 13 May, 1998

Does the temp. profiles used to reflow double sided pcb's through a IR oven on FR4 board material have to be re-established if it is changed to polyimide? Boards will be baked out prior to assembly. any response would be most appreciated.

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JACK CHEN

#15925

Re: FR4 vs Polymide | 14 May, 1998

| Does the temp. profiles used to reflow double sided pcb's through a IR oven | on FR4 board material have to be re-established if it is changed to | polyimide? Boards will be baked out prior to assembly. | any response would be most appreciated.

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Earl Moon

#15926

Re: FR4 vs Polymide | 15 May, 1998

| | | Does the temp. profiles used to reflow double sided pcb's through a IR oven | | on FR4 board material have to be re-established if it is changed to | | polyimide? Boards will be baked out prior to assembly. | | any response would be most appreciated.

There is no difference provided your reflow system is of a modern convection type. One thing to be careful about is how well, or how much cure has been effected with polyimide. It will delaminate if very high Tg's are required. If the Tg is specified at about 250 C., there will be few problems. If a full cure of 270 degrees is effected many problems may occur. Earl Moon

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