We have few questions for BGA assembly. Specially with Fuji machines. 1. What are the testing mechanism other then X-rays. 2. How we get data from Fuji to check repeatability and reproducibility in terms of percentage and how it as calculated. 3. Do you have PPM and DPM data for BGA if yes please give us. 4. Please provide cp/cpk for the Fuji for BGA habdling. 5. What are the various type of defects and how do you identify a defect. Thanks.