Test equipment for our current product| 17 June, 1998
1. I need to be able to probe into my product's substrate which has all components in die form. I would need to be able to bring out any pad information for hookup to a scope or any other external piece of equipment. I do not have the convenience of removing the ceramic substrate from the product, but will have to probe inside the product while it is functional from my own external source. I only have to remove the top plastic housing to have free access to the internal circuitry (all in die form). I would be able to manufacture a holding plate for the product, in order to secure it precisely. An optical vision system is a must. 2. I also need to repair any broken gold or aluminum bond wire that may be broken. The board cannot be removed from the product, but is easily accessable after the top plastic covering is removed. I would be able to manufacture a holding plate for the product, in order to secure it precisely.