Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Solder joint quality/reliability - Mass reflow vs. handsoldering

G. Hamblett

#15231

Solder joint quality/reliability - Mass reflow vs. handsoldering | 25 June, 1998

Looking for articles/data comparing the quality/reliability of mass reflowed SMT solderjoints versus hand soldered SMT solderjoints.

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Earl Moon

#15232

Re: Solder joint quality/reliability - Mass reflow vs. handsoldering | 25 June, 1998

| Looking for articles/data comparing the quality/reliability of mass | reflowed SMT solderjoints versus hand soldered SMT solderjoints.

As solder joint quality most often is subjective - that is visually compared with graphic examples, IPC is the Bible concerning guidlines. It makes no difference the soldering method as far as initial quality is concerned - for the most part. I mean, solder joint quality requires smooth, shiny, bright, well feathered and filleted, sufficient solder - solder joints. Beyond initial quality the world of reliability lives. In this world, more objective (less visual) test data exists, or always is being formulated, concerning solder joint types (leadless, leaded, through hole, chip terminations, BGA balls, etc.) based on requirements as thermal cycles to failure, mechanical shock, etc. This data always should be correlated with the visually compiled acceptance criteria. Earl Moon

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