Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Steve

#14645

Solder Ball Aspect Ratio | 19 August, 1998

How is the aspect ratio of a reliable BGA joint defined? Is it best to have H/W between two limits? What are these?

reply »

Dave F

#14646

Re: Solder Ball Aspect Ratio | 21 August, 1998

| How is the aspect ratio of a reliable BGA joint defined? Is it best to have H/W between two limits? What are these? Steve: People on TechNet have spent alot of time talking about BGA pad design. Use the link below. Dave

reply »

reflow oven profiler

Non-heated dispensing system