Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Scott Christensen

#14347

BGA Singulation Methods? | 10 September, 1998

At the current time we are scoring and then depanelizing by hand. Can anybody provide info on other techniques for separating parts from the panel? Thanks in advance. Scott C.

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S. Evers

#14349

Re: BGA Singulation Methods? | 10 September, 1998

| At the current time we are scoring and then | depanelizing by hand. Can anybody provide | info on other techniques for separating parts | from the panel? Thanks in advance. | Scott C. Something new that got its start in Japan is now being used for BGA. One pass singulation. NOT a punch, but close. Just as fast but no stress forces involved. Easily automated. Check out pioneer@pioneerdie.com Phone: 508-643-2297 Attn: Gerry Larson, "tell him hi for me"

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Dale Eble

#14348

Re: BGA Singulation Methods? | 17 September, 1998

There is a company named Cencorp in Longmont, Colorado that makes depaneling equipment. They are used extensively for boards, including processor modules e.g, Pentium II / Power PC. - They were working on version for BGA - they may have something now.

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