Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


parag

#14133

flip chip bonder | 23 September, 1998

does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap.

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Earl Moon

#14135

Re: flip chip bonder | 24 September, 1998

| does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap. Characterization means determining a machine or processes' capabilities. If you need to place, solder, print, or otherwise manage a process to effect a specified quality level, you must know what machine, tool, etc. can do the job and how well. If you need placement accuracy to within .0001", as an example, you must characterize (evaluate) a placement machine's ability to meet that requirement. Use SPC as a tool to characterize what you need. Earl Moon

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Dave F

#14134

Re: flip chip bonder | 24 September, 1998

| does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap. Parag: Check the link below to the JEDEC download page. Get yourself a copy of "EIA/JEP 132 Process Characterization" to get started. Dave F

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