Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Heat inuslating material

Ray N. Lopez Mata

#14035

Heat inuslating material | 30 September, 1998

I am looking for a material which may be used to deflect heat / shield a component from heat. The component would be exposed to the heat during the card reflow process. I would need the material to be of such a nature that I could form a cover by drilling, milling and so on. I have used aluminum and have achieved measure of success however not to the level required. Thanks in advance. Ray (512) 823-6737

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CHAD HAIMA

#14036

Re: Heat inuslating material | 30 September, 1998

I am looking for a material which may be used to deflect heat / shield a component from heat. The component would be exposed to the heat during the card reflow process. | | I would need the material to be of such a nature that I could form a cover by drilling, milling and so on. | | I have used aluminum and have achieved measure of success however not to the level required. | | Thanks in advance. | | Ray | (512) 823-6737 | | Ray, you might consider the composit materials like Delmat, Durapol, Glastic, Durastone, Haysite, etc. Contact me offline if you need more info. Thanks, Chad 503-357-9228

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